DH 200 mobile bga rework station

Total Power: 2300W

Top hot air heater: 450W

Bottom: diode heater 1800W

Power: AC220V±10％  50Hz

Lighting: Taiwan led working light, any angle adjusted.

Operation mode:

High definition touch screen, intelligent conversational interface, digital system setting

Storage 5000 groups.Top heater movement Automatic up / down with button,  manual Right/left, 

Bottom diode heating Manual right / left movement.

Positioning: Intelligent positioning, PCB can be adjusted in X, Y direction with “5 points support” + V-groov pcb bracket + universal fixtures.

Temperature control: K sensor, close loop

Temp accuracy: ±2℃

PCB size: Max 170×220 mm Min 22×22 mm

BGA chip: 2x2 mm - 80x80 mm

Minimum chip spacing: 0.15mm

External temper sensor: 1pc

Dimensions: L540*W310*H500mm

Net weight: 16KG