Ding Hua DH-G200 stazione saldante bga rework con alliniamento ottico

Total power: 5300W (upper 1200W,

lower 1200W, bottom 2700W)

Position: v-groove clamping + pcb

support + universal fixture

Temperature: K sensor close loop

control

Temperature accuracy: ±1℃

Placement accuracy: ±0.01mm

Camera magnification: 10x-100x

Workbench fine tuning: ±15mm

forward/backward right/left

PCB size: Max 400x380mm Min

20x20mm

BGA chip: 2x2mm~50x50mm

Minimum chip space: 0.15mm

Machine dimension:550x580x720mm

(L*W*H)

Package dimension: 870x680x820mm

(L*W*H)